Invention Grant
- Patent Title: Device for controlling and limiting thermal injury to tissue during thermal procedures where tissue is simultaneously mechanically deformed
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Application No.: US16432318Application Date: 2019-06-05
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Publication No.: US11357589B2Publication Date: 2022-06-14
- Inventor: Brian Jet-Fei Wong
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agency: Shimokaji IP
- Main IPC: A61B90/00
- IPC: A61B90/00 ; A61B18/02 ; A61B18/00 ; A61B17/00 ; A61B17/29 ; A61B18/24
Abstract:
The illustrated embodiments include an apparatus to reduce or eliminate full thickness injury in tissue and to deform tissue which includes a probe or mechanism for deforming tissue, and a subsystem for selectively cooling and/or heating tissue while deformation is of the tissue is being performed. The illustrated embodiments of the invention also extend to a method to reduce or eliminate full thickness injury in tissue and to deform tissue including the steps of deforming tissue, and selectively cooling and/or heating tissue while deformation of the tissue is being performed.
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