Invention Grant
- Patent Title: Workpiece collecting point units and methods for supporting the processing of workpieces
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Application No.: US16387768Application Date: 2019-04-18
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Publication No.: US11358180B2Publication Date: 2022-06-14
- Inventor: Manuel Kiefer , Jens Ottnad , Eberhard Wahl , Korbinian Weiss , Benjamin Schwarz , Philipp Springer
- Applicant: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Applicant Address: DE Ditzingen
- Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee Address: DE Ditzingen
- Agency: Fish & Richardson P.C.
- Priority: DE102016120132.4 20161021
- Main IPC: B07C7/00
- IPC: B07C7/00 ; B25J9/16 ; G05B19/418 ; G06V40/20 ; B23Q7/12 ; B26D5/00 ; G05B19/401 ; G05B19/4093

Abstract:
A workpiece collecting point unit for a machine tool, in particular for a flatbed machine tool, such as a laser cutting or punching flatbed machine tool, has a placing area for workpieces produced by the machine tool within the framework of a processing plan, a display unit adapted to display information about the workpieces, which are to be further processed and were placed on the placing area, to an operator, and a signal device adapted to output an identification signal indicating to an operator the location of the selected workpiece collecting point unit for placing the workpiece, which is to be further processed, on the placing area. The workpiece collecting point unit can be used inter alia in a process to support a sequence of processing steps for processing workpieces.
Public/Granted literature
- US20190240703A1 WORKPIECE COLLECTING POINT UNITS AND METHODS FOR SUPPORTING THE PROCESSING OF WORKPIECES Public/Granted day:2019-08-08
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