Examples include a fluid ejection device comprising a carrier, at least one fluid ejection die, and conductive traces at least partially embedded in the carrier. The carrier has a first portion and a second portion, where an angle of orientation between the first portion and the second portion is nonparallel. The first portion includes an array of openings formed through a top surface of the carrier. The second portion includes at least one die opening through a bottom surface of the carrier. The fluid ejection die is coupled to the second portion of the carrier. Fluid passages formed in a back surface of the fluid ejection die are exposed through the at least one die opening formed through the bottom surface of the carrier. The conductive traces have an array of contact points at first ends of the conductive traces. The array of contact points align with the array of openings of the first portion of the carrier such that the array of contact points are exposed through the array of openings. The conductive traces connect the fluid ejection die and the array of contact points.