- Patent Title: Printhead module having through-slots for supplying power and data
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Application No.: US17017333Application Date: 2020-09-10
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Publication No.: US11358391B2Publication Date: 2022-06-14
- Inventor: Jason Mark Thelander , David Oliver Burke
- Applicant: MEMJET TECHNOLOGY LIMITED
- Applicant Address: IE Dublin
- Assignee: MEMJET TECHNOLOGY LIMITED
- Current Assignee: MEMJET TECHNOLOGY LIMITED
- Current Assignee Address: IE Dublin
- Agency: Cooley LLP
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/145 ; B41J2/175 ; B41J2/21 ; B41J2/155 ; B41J2/17

Abstract:
A printhead module includes a monolithic substrate having a plurality of rows of print chips mounted thereon. Each row of print chips receives power and data through a respective longitudinal slot defined through a thickness of the substrate, each longitudinal slot extending parallel with and offset from the rows of print chips.
Public/Granted literature
- US20210078326A1 PRINTHEAD MODULE HAVING THROUGH-SLOTS FOR SUPPLYING POWER AND DATA Public/Granted day:2021-03-18
Information query
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