Invention Grant
- Patent Title: Thermally conductive thin-film cured product, method for producing same, and thermally conductive member
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Application No.: US16962733Application Date: 2019-01-08
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Publication No.: US11359111B2Publication Date: 2022-06-14
- Inventor: Takanori Ito , Akihiro Endo , Yuki Tanaka
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2018-005469 20180117
- International Application: PCT/JP2019/000139 WO 20190108
- International Announcement: WO2019/142688 WO 20190725
- Main IPC: C09D183/04
- IPC: C09D183/04 ; C08K3/22 ; C08G77/50 ; C08J5/18 ; C08K3/08 ; C08K3/20 ; C08K3/28 ; C08K5/5425 ; C09J11/04 ; C09J11/06 ; C09J11/08 ; C09K5/14

Abstract:
Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si—H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.1-1,000 ppm (mass), inclusive, with respect to component (a) in terms of the mass of the platinum group metal element; (e) a reaction regulator, as required; (f) 50-300 parts by mass, inclusive, of a silicone resin; and (g) 0.1-20 parts by mass, inclusive, of an adhesive component selected from (g-1) or (g-2).
Information query
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