Invention Grant
- Patent Title: Polishing liquid and chemical mechanical polishing method
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Application No.: US16939227Application Date: 2020-07-27
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Publication No.: US11359113B2Publication Date: 2022-06-14
- Inventor: Tetsuya Kamimura
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-060516 20180327
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; C09K3/14 ; H01L21/3105 ; H01L21/321

Abstract:
A polishing liquid, which is used for chemical mechanical polishing, includes ceria particles having an average aspect ratio of 1.5 or more; and an anionic polymer or a cationic polymer, in which a pH of the polishing liquid is 3 to 8. In a case where the polishing liquid contains the anionic polymer, the polishing liquid further includes an inorganic acid or an organic acid including at least one group selected from the group consisting of a carboxylic acid group, a phosphoric acid group, a phosphonic acid group, and a sulfonic acid group.
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