Invention Grant
- Patent Title: Thermocurable electroconductive adhesive
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Application No.: US16330526Application Date: 2017-08-17
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Publication No.: US11359116B2Publication Date: 2022-06-14
- Inventor: Tomoya Kodama , Soichi Ota , Masayuki Osada , Hitoshi Mafune , Makoto Kato , Kanako Morii
- Applicant: THREEBOND CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: THREEBOND CO., LTD.
- Current Assignee: THREEBOND CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JPJP2016-173774 20160906
- International Application: PCT/JP2017/029568 WO 20170817
- International Announcement: WO2018/047598 WO 20180315
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J11/04 ; C09J11/06 ; C09J133/08 ; H01B1/20 ; C08K3/08 ; C08K9/04

Abstract:
Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.
Public/Granted literature
- US20210277289A1 THERMOSETTING ELECTROCONDUCTIVE ADHESIVE Public/Granted day:2021-09-09
Information query
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