Invention Grant
- Patent Title: Adhesive resin composition, method for bonding adherends, and adhesive resin film
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Application No.: US16074945Application Date: 2016-12-12
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Publication No.: US11359117B2Publication Date: 2022-06-14
- Inventor: Hirokazu Iizuka , Kunihiro Takei , Yuiko Maruyama , Yuki Sato
- Applicant: FUJIMORI KOGYO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIMORI KOGYO CO., LTD.
- Current Assignee: FUJIMORI KOGYO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Hauptman Ham, LLP
- Priority: JPJP2016-021940 20160208
- International Application: PCT/IB2016/001741 WO 20161212
- International Announcement: WO2017/137796 WO 20170817
- Main IPC: B32B7/12
- IPC: B32B7/12 ; C09J123/26 ; C09J7/20 ; C09J163/04 ; C09J151/06 ; C09J7/30 ; B32B37/12 ; B32B38/00

Abstract:
The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.
Public/Granted literature
- US20190031928A1 ADHESIVE RESIN COMPOSITION, METHOD FOR BONDING ADHERENDS, AND ADHESIVE RESIN FILM Public/Granted day:2019-01-31
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