The present disclosure relates to a lead-free high tensile brass alloy containing 50-65 wt. % Cu; 0.4-3 wt. % Mn; 0.55-3 wt. % Sn; max 1 wt. % Fe; max 1 wt.-% Ni; max. 1 wt.-% Al; max 1.5 wt.-% Si; the remainder being Zn and inevitable impurities, and the sum of elements Mn and Sn being at least 1.3 wt.-% and not more than 6.0 wt.-%.