Invention Grant
- Patent Title: High entropy alloy structure and a method of preparing the same
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Application No.: US16196224Application Date: 2018-11-20
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Publication No.: US11359266B2Publication Date: 2022-06-14
- Inventor: Yong Yang , Zhaoyi Ding , Quanfeng He
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowlonn
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowlonn
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: C22C30/00
- IPC: C22C30/00 ; C22F1/16 ; C22C1/02
Abstract:
A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy with eutectic microstructure therein; and subjecting the bulk alloy to an acidic condition to form a bulk porous structure with eutectic microstructure therein. A high entropy alloy structure is also provided as prepared by the method.
Public/Granted literature
- US20200157663A1 HIGH ENTROPY ALLOY STRUCTURE AND A METHOD OF PREPATING THE SAME Public/Granted day:2020-05-21
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