Invention Grant
- Patent Title: Self-supporting ultra-fine nanocrystalline diamond thick film
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Application No.: US17043395Application Date: 2018-04-18
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Publication No.: US11359276B2Publication Date: 2022-06-14
- Inventor: Nan Jiang , He Li , Bo Wang , Jian Yi , Yang Cao
- Applicant: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Zhejiang
- Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES
- Current Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Zhejiang
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: CN201810273492.X 20180329
- International Application: PCT/CN2018/083523 WO 20180418
- International Announcement: WO2019/184019 WO 20191003
- Main IPC: C23C16/27
- IPC: C23C16/27 ; C23C16/01 ; C23C16/50 ; C23C16/02
Abstract:
A self-supporting ultra-fine nanocrystalline diamond thick film, the thickness being 100-3000 microns, wherein 1 nanometer≤diamond grain size≤20 nanometers. A method for using chemical vapor deposition to grow ultra-fine nanocrystalline diamond on a silicon substrate, and separating the silicon substrate and the diamond to acquire the self-supporting ultra-fine nanocrystalline diamond thick film. The chemical vapor deposition method is simple and effective, and prepares a high-quality ultra-fine nanocrystalline diamond thick film.
Public/Granted literature
- US20210140038A1 SELF-SUPPORTING ULTRA-FINE NANOCRYSTALLINE DIAMOND THICK FILM Public/Granted day:2021-05-13
Information query
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