Invention Grant
- Patent Title: Joint filling profile
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Application No.: US16782226Application Date: 2020-02-05
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Publication No.: US11359367B2Publication Date: 2022-06-14
- Inventor: Stefan Wiegrink
- Applicant: SK Wiegrink Beteiligungs GmbH
- Applicant Address: DE Bocholt
- Assignee: SK Wiegrink Beteiligungs GmbH
- Current Assignee: SK Wiegrink Beteiligungs GmbH
- Current Assignee Address: DE Bocholt
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: DE202019101140.8 20190228
- Main IPC: E04B1/68
- IPC: E04B1/68 ; E01D19/06 ; E01C11/04 ; E01C11/02 ; E04F15/02 ; E04F15/14

Abstract:
A joint filling profile for forming a joint sealing between floor slabs includes a vertical leg projecting into the joint and a profile body formed from a joint sealing compound and located in a joint widening. The vertical leg and the profile body are separated from each other with the interposition of a first separating material, wherein at least one second separating material is arranged between the vertical leg and the profile body and/or at least one reinforcing mat is arranged within the profile body. The second separating material and/or the reinforcing mat are arranged in such a way that they overlap with the first separating material at least in regions.
Public/Granted literature
- US20200277779A1 Joint Filling Profile Public/Granted day:2020-09-03
Information query
IPC分类: