A package of laminations includes a plurality of lamella segments, which are arranged in layers and embodied to be connected together as ring segments. Each of the lamella segments has a plurality of cutouts and at least one of the lamella segments has at least three cutouts. The lamella segments are interconnected via sleeves. A method for manufacturing a package of laminations, a multi-plate coupling employing the package of laminations and an industrial application using the package of laminations are also described.