An apparatus includes a method for providing a Shape Memory Polymer Based Passive Thermal Diode (SMP-PTD) that includes layers and is configured to provide passive heating and cooling of a pipeline. The SMP-PTD includes a polyurethane (PU) layer configured to contact at least an upper portion along a length of a pipe. The SMP-PTD further includes a polyethylene terephthalate (PET) layer configured to surround the PU layer and the length of the pipe. The SMP-PTD further includes a graphene layer configured to surround an upper side of the SMP-PTD and cross layers of the SMP-PTD toward a bottom side of the SMP-PTD to establish contact with the pipe. The SMP-PTD further includes an epoxy shell configured to surround the graphene layer. The SMP-PTD further includes a shape memory polymer (SMP) ring configured to provide vertical displacement and push upward upon lateral displacement from pushing by left and right PET blocks. The SMP-PTD is installed on the pipeline.