Invention Grant
- Patent Title: Embedding apparatus
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Application No.: US17044785Application Date: 2019-05-21
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Publication No.: US11360007B2Publication Date: 2022-06-14
- Inventor: Masahisa Mimura , Yoshiaki Nakazawa , Mitsuaki Narita
- Applicant: SAKURA SEIKI CO., LTD. , SAKURA FINETEK JAPAN CO., LTD.
- Applicant Address: JP Nagano; JP Tokyo
- Assignee: SAKURA SEIKI CO., LTD.,SAKURA FINETEK JAPAN CO., LTD.
- Current Assignee: SAKURA SEIKI CO., LTD.,SAKURA FINETEK JAPAN CO., LTD.
- Current Assignee Address: JP Nagano; JP Tokyo
- Agency: Leech Tishman Fuscaldo & Lampl
- Agent William Thomas Babbitt, Esq.
- Priority: JPJP2018-139203 20180725
- International Application: PCT/JP2019/020019 WO 20190521
- International Announcement: WO2020/021830 WO 20200130
- Main IPC: G01N1/00
- IPC: G01N1/00 ; G01N1/36 ; G01N33/48

Abstract:
The present invention addresses an object to provide an embedding apparatus capable of removing an embedding material such as paraffin and solids such as debris of a tissue fragment adhered to a tweezers holder hole easily. As a solving means, an embedding apparatus (10) includes: a tweezers holder (26) including a tweezers holder hole (26a); a first heater (34) configured to warm the tweezers holder (26); a first sensor (40) configured to detect a temperature of the tweezers holder (26); and a control unit (46) wherein the control unit (46) performs control to turn the first heater (34) OFF until the temperature reaches a point equal to or below a first set temperature at which the embedding material adhered to the tweezers holder hole (26a) starts to solidify, and upon receipt of a signal indicating that the temperature of the tweezers holder (26) reaches the first set temperature from the first sensor (40), turn the first heater (34) ON until the temperature reaches a second set temperature at which a sticking site between the solidified embedding material and the tweezers holder hole (26a) is melted.
Public/Granted literature
- US20210190651A1 EMBEDDING DEVICE Public/Granted day:2021-06-24
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