A contact pin, in particular a spring contact pin, comprising a test head for contacting an electrically conductive contact surface of a test object, in particular a wafer, a printed circuit board or the like, and comprising a pin sleeve, in which the test head is mounted with a guide end in a longitudinally displaceable manner. At least in some sections, a flexible, deformable/deformed circuit carrier is provided, on which at least one electrical/electronic component is arranged and which is or can be axially inserted into the pin sleeve by rolling and/or folding.