Invention Grant
- Patent Title: Current sensor and method for manufacturing current sensor
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Application No.: US16916178Application Date: 2020-06-30
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Publication No.: US11360122B2Publication Date: 2022-06-14
- Inventor: Kenji Suzuki , Kenji Kai
- Applicant: Asahi Kasei Microdevices Corporation
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Microdevices Corporation
- Current Assignee: Asahi Kasei Microdevices Corporation
- Current Assignee Address: JP Tokyo
- Priority: JPJP2019-128714 20190710,JPJP2020-084150 20200512
- Main IPC: G01R15/20
- IPC: G01R15/20 ; H01L43/14 ; H01L43/06 ; G01R19/00

Abstract:
Provided is a current sensor for reducing heat generation caused by energization. The current sensor is provided, including: primary terminals; a first magnetic sensor; a primary conductor; and a signal processing IC; wherein the primary conductor has a bend section including: a first region that surrounds at least a part of the first magnetic sensor in planar view and at least a part of which does not face the signal processing IC; and a second region that faces the signal processing IC; wherein the height of the first region is lower than that of the primary terminal, the height of the second region is lower than that of the first region, and the first magnetic sensor is connected to the signal processing IC through conductive wires, on the opposite side from the plane.
Public/Granted literature
- US20210011058A1 CURRENT SENSOR AND METHOD FOR MANUFACTURING CURRENT SENSOR Public/Granted day:2021-01-14
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