Invention Grant
- Patent Title: System and method for tilt calculation based on overlay metrology measurements
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Application No.: US17087417Application Date: 2020-11-02
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Publication No.: US11360398B2Publication Date: 2022-06-14
- Inventor: Roie Volkovich , Paul MacDonald , Ady Levy , Jincheng Pei , Jinyan Song , Amnon Manassen
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A metrology system includes a controller communicatively coupled to one or more metrology tools. In another embodiment, the controller includes one or more processors configured to execute program instructions causing the one or more processors to receive one or more overlay metrology measurements of one or more metrology targets of the metrology sample from the one or more metrology tools; determine tilt from the one or more measurement overlay measurements; and determine one or more correctables for at least one of one or more lithography tools or the one or more metrology tools to adjust for the tilt, where the one or more correctables are configured to reduce an amount of tilt in the sample or overlay inaccuracy of the one or more overlay metrology measurements. The program instructions further cause the one or more processors to predict tilt with a simulator based on at least the determined tilt.
Public/Granted literature
- US20210149313A1 SYSTEM AND METHOD FOR TILT CALCULATION BASED ON OVERLAY METROLOGY MEASUREMENTS Public/Granted day:2021-05-20
Information query
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