Invention Grant
- Patent Title: Mounting assemblies for peripheral modules
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Application No.: US16075598Application Date: 2017-07-06
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Publication No.: US11360506B2Publication Date: 2022-06-14
- Inventor: Gregory C. Franke , Chih Chien Chen , Ming-Shan Tsai
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: Conley Rose PC
- International Application: PCT/US2017/040938 WO 20170706
- International Announcement: WO2019/009907 WO 20190110
- Main IPC: H05K5/02
- IPC: H05K5/02 ; G06F1/16 ; G06F13/10

Abstract:
In some examples, an electronic device includes an outer housing an outer housing including a recess to receive a peripheral module. In addition, the electronic device includes a mounting assembly to move the peripheral module into and out of the recess of the outer housing. The mounting assembly is moveably coupled to the outer housing. The mounting assembly includes a latch mechanism to removably attach the mounting assembly to the peripheral module. The mounting assembly includes a first electrical connector to removably connect to a second electrical connector of the peripheral module. The latch mechanism includes an arm and a lip to move into and out of engagement with a shoulder of the peripheral module. The lip is disposed along the arm.
Public/Granted literature
- US20200209914A1 MOUNTING ASSEMBLIES FOR PERIPHERAL MODULES Public/Granted day:2020-07-02
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