Invention Grant
- Patent Title: Haptic feedback module
-
Application No.: US16953056Application Date: 2020-11-19
-
Publication No.: US11360562B2Publication Date: 2022-06-14
- Inventor: Yung Ting , Sheuan-Perng Lin , Jun-Hong Lin , Rahmad-Aldori Yopan
- Applicant: CHUNG-YUAN CHRISTIAN UNIVERSITY
- Applicant Address: TW Chung Li
- Assignee: CHUNG-YUAN CHRISTIAN UNIVERSITY
- Current Assignee: CHUNG-YUAN CHRISTIAN UNIVERSITY
- Current Assignee Address: TW Chung Li
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW109118161 20200529
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H04R17/00 ; G06F3/01

Abstract:
A haptic feedback module with a touch panel and a piezoelectric haptic feedback module is disclosed. The piezoelectric haptic feedback module contacts with the touch panel and has a first soft circuit board and a plurality of piezoelectric units. The first soft circuit board has a plurality of first electrode areas and each first electrode area has a first length. Each of the piezoelectric units is respectively configured below each of the first electrode areas. Each of the piezoelectric units has a second length, wherein the first length is 10% to 20% of the second length.
Public/Granted literature
- US20210373667A1 HAPTIC FEEDBACK MODULE Public/Granted day:2021-12-02
Information query