A multi-memory SD card includes an enclosure having the outer dimensions of a standard SD card. Two separate SiP SD packages are provided along with two separate sets of electrical contacts each according to the SD standard to provide, in a single SD card bundle, the functions and performance of two SD cards. The SiP packages may both be full size SD format, or one may be a micro- or nano- SD card. The first and second SiP SD packages has the same or different capacity and/or speed, and the micro- or nano- SiP package is permanent or removable. An onboard battery and/or PCB may also be housed in the enclosure for configuring WiFi/redundant array of independent disks (RAID) or backup.