Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16698279Application Date: 2019-11-27
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Publication No.: US11361946B2Publication Date: 2022-06-14
- Inventor: Masato Kon
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2018-223920 20181129
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01L21/683

Abstract:
In a substrate processing apparatus, a processing chamber, in which a target substrate is disposed and substrate processing is performed on the target substrate, is provided. A consumable part is disposed in the processing chamber and consumed by the substrate processing. A supply unit is configured to supply an ionic liquid in response to a consumption of the consumable part. A drive unit is configured to drive the consumable part by using the ionic liquid supplied from the supply unit.
Public/Granted literature
- US20200176229A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2020-06-04
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