Invention Grant
- Patent Title: Temperature measurement for substrate carrier using a heater element array
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Application No.: US16440632Application Date: 2019-06-13
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Publication No.: US11361948B2Publication Date: 2022-06-14
- Inventor: Phillip Criminale , Zhiqiang Guo
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H05B3/06 ; H01L21/67 ; H01L21/66

Abstract:
Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.
Public/Granted literature
- US20190295824A1 TEMPERATURE MEASUREMENT FOR SUBSTRATE CARRIER USING A HEATER ELEMENT ARRAY Public/Granted day:2019-09-26
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