Invention Grant
- Patent Title: Method and apparatus for processing substrate
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Application No.: US16673267Application Date: 2019-11-04
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Publication No.: US11361962B2Publication Date: 2022-06-14
- Inventor: Seung Hoon Oh , Jin Tack Yu , Bu Young Jung , Byung Sun Bang , Young Jin Kim , Young Jun Choi , Jong Hyeon Woo
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR10-2018-0135371 20181106
- Main IPC: H01L21/02
- IPC: H01L21/02 ; G03F7/16 ; H01L21/687 ; H01L21/67

Abstract:
An embodiment of the present invention provides a substrate processing method. The substrate processing method, which performs a liquid processing process by injecting a processing liquid on a substrate on a spin chuck disposed inside a plurality of recovery cups that are disposed in multiple layers, includes: in a transitional period of time in which height change of any one of the recovery cups occurs, adjusting rotational speed of the spin chuck, which is configured to support the substrate, in conjunction with the height change of the recovery cup.
Information query
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