Invention Grant
- Patent Title: Gas delivery module
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Application No.: US16926422Application Date: 2020-07-10
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Publication No.: US11361978B2Publication Date: 2022-06-14
- Inventor: Adib M. Khan , Qiwei Liang , Sultan Malik , Srinivas D. Nemani
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/447
- IPC: H01L21/447 ; C23C16/452 ; H01L21/67
Abstract:
The present disclosure relates to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.
Public/Granted literature
- US20200343103A1 GAS DELIVERY MODULE Public/Granted day:2020-10-29
Information query
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