Invention Grant
- Patent Title: Batch substrate support with warped substrate capability
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Application No.: US16198417Application Date: 2018-11-21
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Publication No.: US11361981B2Publication Date: 2022-06-14
- Inventor: Shashidhara Patel , Ananthkrishna Jupudi , Ribhu Gautam
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: H01L21/677
- IPC: H01L21/677 ; C23C16/458 ; H01L21/68 ; H01L21/673
Abstract:
Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.
Public/Granted literature
- US20190341286A1 BATCH SUBSTRATE SUPPORT WITH WARPED SUBSTRATE CAPABILITY Public/Granted day:2019-11-07
Information query
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