Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16721752Application Date: 2019-12-19
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Publication No.: US11362180B2Publication Date: 2022-06-14
- Inventor: Yun-Yuan Wang , Chih-Hsiang Hsiao , I-Chih Ni , Chih-I Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , NATIONAL TAIWAN UNIVERSITY
- Applicant Address: TW Hsinchu; TW Taipei
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Hsinchu; TW Taipei
- Agency: Maschoff Brennan
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/08 ; H01L29/41 ; H01L29/40

Abstract:
A semiconductor device includes a substrate, a channel stack, source/drain contacts, and a gate electrode. The channel stack is over the substrate and includes a 2D channel layer and a barrier layer. An energy band gap of the barrier layer is greater than an energy band gap of the 2D channel layer. The source/drain contacts are in contact with the channel stack. The gate electrode is above the substrate.
Public/Granted literature
- US20210193801A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-06-24
Information query
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