Invention Grant
- Patent Title: Semiconductor device and method
-
Application No.: US16382860Application Date: 2019-04-12
-
Publication No.: US11362199B2Publication Date: 2022-06-14
- Inventor: I-Hsieh Wong , Yen-Ting Chen , Wei-Yang Lee , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L29/78 ; H01L21/3065 ; H01L21/02 ; H01L21/311 ; H01L21/306

Abstract:
In an embodiment, a method includes: forming a fin extending from a substrate, the fin having a first width and a first height after the forming; forming a dummy gate stack over a channel region of the fin; growing an epitaxial source/drain in the fin adjacent the channel region; and after growing the epitaxial source/drain, replacing the dummy gate stack with a metal gate stack, the channel region of the fin having the first width and the first height before the replacing, the channel region of the fin having a second width and a second height after the replacing, the second width being less than the first width, the second height being less than the first height.
Public/Granted literature
- US20200176591A1 Semiconductor Device and Method Public/Granted day:2020-06-04
Information query
IPC分类: