Invention Grant
- Patent Title: Contact interface engineering for reducing contact resistance
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Application No.: US16572812Application Date: 2019-09-17
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Publication No.: US11362212B2Publication Date: 2022-06-14
- Inventor: Mrunal A Khaderbad , Keng-Chu Lin , Sung-Li Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L29/78 ; H01L29/66 ; H01L29/417

Abstract:
A structure includes a transistor including a first source/drain region, a source/drain contact plug over and electrically coupling to the first source/drain region, and a via over and contacting the source/drain contact plug. The via has a bottom portion having a first length, and an upper portion having a second length. The first length is greater than the second length. Both of the first length and the second length are measured in a same direction parallel to a top surface of the source/drain contact plug.
Public/Granted literature
- US20210083119A1 Contact Interface Engineering for Reducing Contact Resistance Public/Granted day:2021-03-18
Information query
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