Invention Grant
- Patent Title: Multi-connection device
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Application No.: US16499378Application Date: 2018-03-22
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Publication No.: US11362452B2Publication Date: 2022-06-14
- Inventor: Sung-Hyup Lee , Jae-Woon Lee , Yong-Seok Lee , Yang-Jean Park , Jin-Woo Park
- Applicant: Samsung Electronics Co., Ltd. , Hyupjinconnector Co., Ltd.
- Applicant Address: KR Gyeonggi-do; KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.,Hyupjinconnector Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,Hyupjinconnector Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do; KR Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2017-0041672 20170331
- International Application: PCT/KR2018/003372 WO 20180322
- International Announcement: WO2018/182235 WO 20181004
- Main IPC: H01R13/24
- IPC: H01R13/24 ; H01R13/46
Abstract:
A multi-connection device according to various embodiments of the present invention may comprise: a housing; and a first or a second connection terminal for electrical connection, the first and second connection terminals protruding in first and second directions from the housing, respectively. Various other embodiments may also be possible.
Public/Granted literature
- US20200052427A1 MULTI-CONNECTION DEVICE Public/Granted day:2020-02-13
Information query
