Invention Grant
- Patent Title: Electronic device including waterproof printing structure and manufacturing method therefor
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Application No.: US17058183Application Date: 2019-05-21
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Publication No.: US11363733B2Publication Date: 2022-06-14
- Inventor: Jongmun Choi , Hyeonbeom Kim , Hyunsuk Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2018-0059014 20180524
- International Application: PCT/KR2019/006060 WO 20190521
- International Announcement: WO2019/225944 WO 20191128
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H05K5/06 ; C09D5/16 ; H04B1/3827 ; H04M1/18

Abstract:
An electronic device, according to various embodiments, may comprise: an outer housing comprising a front plate facing a first direction, a rear plate facing a direction opposite to the front plate, and a side member for surrounding a space between the front plate and the rear plate, wherein the side member protrudes toward the space and includes a protrusion having a first surface facing the first direction; an opaque layer disposed in the space so as to be parallel with the front plate and including a first portion located between the first surface and the front plate, wherein the first portion includes a second surface facing the first surface; an adhesiveness improvement layer formed on the second surface of the opaque layer and having a repetitive pattern; and a waterproof layer disposed between the adhesiveness improvement layer and the first surface and attached to the adhesiveness improvement layer and the first surface. Other various embodiments may be possible.
Public/Granted literature
- US20210168958A1 ELECTRONIC DEVICE INCLUDING WATERPROOF PRINTING STRUCTURE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2021-06-03
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