Invention Grant
- Patent Title: Planarization layers over silicon dies
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Application No.: US16645042Application Date: 2017-10-12
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Publication No.: US11364493B2Publication Date: 2022-06-21
- Inventor: Michael W. Cumbie , Chien-Hua Chen
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- International Application: PCT/US2017/056377 WO 20171012
- International Announcement: WO2019/074511 WO 20190418
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B81B7/00

Abstract:
A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.
Public/Granted literature
- US20200282394A1 PLANARIZATION LAYERS OVER SILICON DIES Public/Granted day:2020-09-10
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