Invention Grant
- Patent Title: Method for manufacturing semiconductor device including a semiconductor chip and lead frame
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Application No.: US17110437Application Date: 2020-12-03
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Publication No.: US11367675B2Publication Date: 2022-06-21
- Inventor: Katsuya Sato , Kakeru Yamaguchi , Tetsuya Yamamoto
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-045603 20200316
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L21/60
Abstract:
A method for manufacturing a semiconductor device includes: fixing a semiconductor chip to a first part of a leadframe; bonding one connector member to a first terminal of the semiconductor chip, a second terminal of the semiconductor chip, a second part of the leadframe, and a third part of the leadframe; forming a sealing member; and separating a first conductive part of the connector member and a second conductive part of the connector member by removing at least a section of the portion of the connector member exposed outside the sealing member, the first conductive part being bonded to the first terminal and the second part, the second conductive part being bonded to the second terminal and the third part.
Public/Granted literature
- US20210287969A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2021-09-16
Information query
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