Invention Grant
- Patent Title: Light emitting diode and fabrication method thereof, array substrate and display panel
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Application No.: US16494463Application Date: 2018-11-01
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Publication No.: US11367767B2Publication Date: 2022-06-21
- Inventor: Xiaoliang Ding , Xue Dong , Haisheng Wang , Yingming Liu , Wei Liu , Xueyou Cao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: WHDA, LLP
- International Application: PCT/CN2018/113393 WO 20181101
- International Announcement: WO2020/087435 WO 20200507
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L27/32 ; H01L51/56

Abstract:
The present disclosure is related to a light emitting diode. The light emitting diode includes a first transparent electrode layer; a light emitting layer on the first transparent electrode layer; a reflective electrode layer on a surface of the light emitting layer opposite from the first transparent electrode layer, and a second transparent electrode layer. The reflective electrode layer may include transmission hole. The second transparent electrode layer may cover or fill the transmission hole. The transmission hole may be configured to transmit light emitted from the light emitting layer to pass through the second transparent electrode layer.
Public/Granted literature
- US20210335963A1 LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF, ARRAY SUBSTRATE AND DISPLAY PANEL Public/Granted day:2021-10-28
Information query
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