Invention Grant
- Patent Title: High density and tool-less drive enclosure for a disk array
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Application No.: US16784569Application Date: 2020-02-07
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Publication No.: US11369031B2Publication Date: 2022-06-21
- Inventor: Le Gao , Daniel Bernard Hruska
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A disk array includes a drive enclosure and a pair of rails. The drive enclosure includes a tray with a first base leg and a second base leg spaced from the first base leg, where the tray facilitates receipt of a memory drive device at a space between the first and second base legs such that the drive locking pins engage with openings along surfaces of the memory drive device. A handle pivotally connects with the tray to facilitate rotational movement of the handle in relation to the tray. A pair of rails secure to a printed circuit board (PCB) of an electronic device, and the rails receive and retain portions of the tray and the handle when the tray is inserted between the rails of the pair.
Public/Granted literature
- US20210251098A1 HIGH DENSITY AND TOOL-LESS DRIVE ENCLOSURE FOR A DISK ARRAY Public/Granted day:2021-08-12
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