Invention Grant
- Patent Title: High frequency electromagnetic interference (EMI) composites
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Application No.: US15579077Application Date: 2016-06-02
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Publication No.: US11369050B2Publication Date: 2022-06-21
- Inventor: Dipankar Ghosh
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Yufeng Dong
- International Application: PCT/US2016/035378 WO 20160602
- International Announcement: WO2016/200662 WO 20161215
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Electromagnetic interference (EMI) shielding composites and methods of producing the same are described. Carbon nanostructure (CNS) fillers including cross-linked carbon nanotubes (CNTs) and a polymeric encapsulation material are provided, where the carbon nanotubes are encapsulated by the polymeric encapsulation material. The CNS fillers are treated to remove at least a portion of the polymeric encapsulation material. After removing the polymeric encapsulation material, the CNS fillers are mixed with a curable matrix material to obtain EMI shielding composites. In some cases, the removal of the polymeric encapsulation material results in diminished dielectric polarization characteristics for the composites.
Public/Granted literature
- US20180177081A1 HIGH FREQUENCY ELECTROMAGNETIC INTERFERENCE (EMI) COMPOSITES Public/Granted day:2018-06-21
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