Invention Grant
- Patent Title: Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
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Application No.: US16493427Application Date: 2018-01-18
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Publication No.: US11370066B2Publication Date: 2022-06-28
- Inventor: Yuki Kawana , Hideo Nakako , Motohiro Negishi , Dai Ishikawa , Chie Sugama , Yoshinori Ejiri
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JPJP2017-050091 20170315
- International Application: PCT/JP2018/001442 WO 20180118
- International Announcement: WO2018/168187 WO 20180920
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B23K35/30 ; B23K35/36 ; H01L23/495 ; B22F3/10 ; B23K1/00 ; B23K1/20 ; B22F1/05 ; B22F1/068 ; B23K101/40 ; H01L23/31 ; H01L23/00
Abstract:
Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 ηm, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.
Public/Granted literature
- US1639927A Method and means for warping yarn Public/Granted day:1927-08-23
Information query
