Invention Grant
- Patent Title: Cooling a 3D build volume
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Application No.: US16607736Application Date: 2018-04-23
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Publication No.: US11370172B2Publication Date: 2022-06-28
- Inventor: Matthew G Lopez , Edmund R Nowak , Frank Kozakiewicz , Brian R Jung
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh PC
- International Application: PCT/US2018/028773 WO 20180423
- International Announcement: WO2019/209237 WO 20191031
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y10/00 ; B33Y30/00 ; B33Y50/02 ; B29C64/153 ; B29C64/20 ; B33Y40/20

Abstract:
In an example implementation, a method of cooling a 3D build volume includes receiving a 3D object model that represents a 3D part to be formed in a build volume, and determining a placeholder position for forming a placeholder part within the build volume. Based on the placeholder position, a 3D part position is determined for forming the 3D part within the build volume. The method also includes controlling components of a 3D printing system to form the placeholder part in the placeholder position within the build volume and to form the 3D part in the 3D part position within the build volume.
Public/Granted literature
- US20210331409A1 COOLING A 3D BUILD VOLUME Public/Granted day:2021-10-28
Information query