Invention Grant
- Patent Title: Making low-sodium resin
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Application No.: US16754590Application Date: 2018-10-08
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Publication No.: US11370852B2Publication Date: 2022-06-28
- Inventor: John C. Rohanna , Marvin H. Tegen , Alfred K. Schultz
- Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, INC. , DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
- Applicant Address: US PA Collegeville; US PA Collegeville
- Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.,DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
- Current Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.,DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
- Current Assignee Address: US PA Collegeville; US PA Collegeville
- Agent Carl P. Hemenway; Kenneth Criminaldi
- International Application: PCT/US2018/054794 WO 20181008
- International Announcement: WO2019/083712 WO 20190502
- Main IPC: C08F6/00
- IPC: C08F6/00 ; C08J3/03

Abstract:
Provided is method of treating a collection of resin beads (a) comprising the steps of (a) providing the collection of resin beads (a), wherein the resin beads (a) comprise one or more vinyl polymers having quaternary ammonium groups; wherein 90 mole % or more of the quaternary ammonium groups are each associated with a chloride anion; (b) bringing the collection of resin beads (a) into contact with an aqueous solution (b) comprising one or more dissolved (M)nXq to form a mixture (b), (c) separating water and compounds dissolved in the water from the mixture (b), to form resin beads (c) and waste solution (bw); (d) bringing resin beads (c) into contact with an aqueous solution (c) comprising dissolved (M3)(OH)p, to form a mixture (d).
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