Invention Grant
- Patent Title: Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
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Application No.: US17271745Application Date: 2019-08-28
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Publication No.: US11370857B2Publication Date: 2022-06-28
- Inventor: Yune Kumazawa , Takuya Suzuki , Seiji Shika
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-161792 20180830
- International Application: PCT/JP2019/033681 WO 20190828
- International Announcement: WO2020/045489 WO 20200305
- Main IPC: C08F22/40
- IPC: C08F22/40 ; C08F2/50 ; H05K1/03 ; H05K1/02 ; G03F7/028 ; C08K5/5397 ; H05K3/46
Abstract:
A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).
Public/Granted literature
- US20210206892A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE Public/Granted day:2021-07-08
Information query
IPC分类:
