Invention Grant
- Patent Title: Semiconductor device, semiconductor package, semiconductor module, and semiconductor circuit device
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Application No.: US17037412Application Date: 2020-09-29
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Publication No.: US11371891B2Publication Date: 2022-06-28
- Inventor: Kenichiro Sato
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JPJP2018-067425 20180330,JPJP2018-127942 20180705
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/739 ; H01L29/861 ; H01L23/49 ; H01L23/495 ; G01K7/01 ; H01L23/473
Abstract:
A semiconductor device that can detect temperature appropriately is provided. A semiconductor device provided with a semiconductor substrate in which one or more transistor portions and one or more diode portions are provided is provided, including: a temperature detecting portion provided above the top surface of the semiconductor substrate and having a longitudinal side in a predetermined longitudinal direction; a top surface electrode provided above the top surface of the semiconductor substrate; and one or more external lines that have a connecting part connected with the top surface electrode and electrically connect the top surface electrode to a circuit outside the semiconductor device. The temperature detecting portion extends across the one or more transistor portions and the one or more diode portions in the longitudinal direction, and the connecting part of at least one of the external lines is arranged around the temperature detecting portion when seen from above.
Public/Granted literature
- US20210010871A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR CIRCUIT DEVICE Public/Granted day:2021-01-14
Information query
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