Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16830512Application Date: 2020-03-26
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Publication No.: US11373886B2Publication Date: 2022-06-28
- Inventor: Hiroshi Yoshida
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JPJP2019-067889 20190329
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/311 ; B01F31/00

Abstract:
A substrate processing apparatus includes: a mixer that mixes a first phosphoric acid and an additive serving as raw materials of a processing liquid with each other at a predetermined mixing ratio, thereby preparing a mixed liquid; a mixing ratio corrector that corrects the mixing ratio of the raw materials of the processing liquid; a processing unit that processes a substrate with the processing liquid. The mixer includes a mixing tank that stores the mixed liquid, a first phosphoric acid supply that supplies the first phosphoric acid to the mixing tank, and an additive supply that supplies the additive to the mixing tank. The mixing ratio corrector includes a liquid line through which the mixed liquid is delivered from the mixer to the processing unit, and a second phosphoric acid supply connected to the liquid line so as to supply second phosphoric acid to the liquid line.
Public/Granted literature
- US20200312682A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2020-10-01
Information query
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