An electronic component module includes: a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant disposed on the first surface of the substrate and configured to seal the electronic element; a first pad disposed on an outermost region of a second surface of the substrate; a second pad disposed inward of the first pad on the second surface of the substrate, and positioned parallel to the first pad; and a shielding layer connected to the first pad, and at least partially surrounding a side surface of the encapsulant and a side surface of the substrate. The first and second pads are electrically connected by a connection pad.