Invention Grant
- Patent Title: Electronic devices including capacitors with multiple dielectric materials, and related systems
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Application No.: US17087842Application Date: 2020-11-03
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Publication No.: US11374132B2Publication Date: 2022-06-28
- Inventor: Michael A. Smith
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L29/94
- IPC: H01L29/94 ; G11C16/30 ; H01L29/49 ; H01L21/28 ; H01L27/11526 ; H01L27/11573 ; H01L29/66 ; G11C16/04

Abstract:
A semiconductor structure includes a capacitor structure comprising an active region comprising opposing field edges parallel to a first horizontal direction and a gate region comprising opposing gate edges parallel to a second horizontal direction transverse to the first horizontal direction. The semiconductor structure also comprises a first dielectric material adjacent at least one of the opposing field edges or the opposing gate edges and a second dielectric material adjacent the active area and abutting portions of the first dielectric material. A height of the second dielectric material in a vertical direction may be less than the height of the first dielectric material. Semiconductor devices and related methods are also disclosed.
Public/Granted literature
- US20210074864A1 ELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED SYSTEMS Public/Granted day:2021-03-11
Information query
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