Invention Grant
- Patent Title: Method of manufacturing display device and source substrate structure
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Application No.: US16851321Application Date: 2020-04-17
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Publication No.: US11374149B2Publication Date: 2022-06-28
- Inventor: Takashi Takagi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2019-089336 20190509,KR10-2020-0004312 20200113
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/24 ; H01L33/56

Abstract:
Provided are a method of manufacturing a display device and a source substrate structure. The method of manufacturing the display device includes holding a light-emitting element on a source substrate that passes laser light of a certain wavelength therethrough, the holding being performed by a release layer between the source substrate and the light-emitting element, forming an adhesive layer on a driving substrate on which a driving substrate-side electrode is formed, moving the light-emitting element to a surface of the adhesive layer on the driving substrate from the source substrate by irradiating laser light of the certain wavelength to the release layer through the source substrate, and adhering the moved light-emitting element to the driving substrate by using the adhesive layer, and the release layer comprises a resin material with a thickness that is greater than or equal to 0.1 μm and is less than or equal to 0.5 μm.
Information query
IPC分类: