Invention Grant
- Patent Title: Trisoup node size per slice
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Application No.: US17030244Application Date: 2020-09-23
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Publication No.: US11375208B2Publication Date: 2022-06-28
- Inventor: Alexandre Zaghetto , Danillo Graziosi , Ali Tabatabai , Ohji Nakagami
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Haverstock & Owens, A Law Corporation
- Main IPC: H04N19/167
- IPC: H04N19/167 ; H04N19/174 ; G06T9/00 ; H04N19/119 ; H04N19/96

Abstract:
Trisoup node size per slice enables flexibility when encoding a point cloud. Instead of each block/node being the same size, a user or machine is able to indicate block/node sizes such that regions of interest are able to have smaller node sizes for more specificity in that region.
Public/Granted literature
- US20210400280A1 TRISOUP NODE SIZE PER SLICE Public/Granted day:2021-12-23
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