Invention Grant
- Patent Title: Heat sink
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Application No.: US16610569Application Date: 2017-07-03
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Publication No.: US11375637B2Publication Date: 2022-06-28
- Inventor: Shuhei Mizutani , Takanori Koike
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- International Application: PCT/JP2017/024348 WO 20170703
- International Announcement: WO2019/008634 WO 20190110
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20

Abstract:
A heat sink includes a pipe through which cooled fluid flows and a cooling block having a first face on which the pipe is placed and a second face to which a heat emitting element is attached. The cooling block has a contact region and a noncontact region at positions where the cooling block faces the pipe. In the contact region, the first face contacts the pipe. In the noncontact region, the first face faces the pipe with a gap therebetween. The contact region is included in a projection region defined by projecting a region of attachment of the heat emitting element onto the first face.
Public/Granted literature
- US20200154603A1 HEAT SINK Public/Granted day:2020-05-14
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