Invention Grant
- Patent Title: Cutting tool having partially-removed film formed thereon
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Application No.: US16846441Application Date: 2020-04-13
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Publication No.: US11376675B2Publication Date: 2022-07-05
- Inventor: Seung-Su Ahn , Je-Hun Park , Kyung-il Kim , Sung-Hyun Kim , Sung-Gu Lee , Sun-Yong Ahn
- Applicant: KORLOY INC.
- Applicant Address: KR Seoul
- Assignee: KORLOY INC.
- Current Assignee: KORLOY INC.
- Current Assignee Address: KR Seoul
- Agency: Lex IP Meister, PLLC
- Priority: KR10-2014-0048442 20140423
- Main IPC: B23B51/00
- IPC: B23B51/00 ; B23C5/10

Abstract:
The present invention relates to a cutting tool, which performs, like a drill or a ball end mill, cutting while rotating in a state in which the center of the tip end is in contact with a work material, and includes a wear-resistant layer formed at the tip end thereof, wherein a portion of the wear-resistant layer is selectively removed through tip end polishing from the center of the tip end of the drill or the ball end mill to a predetermined area, so as to restrain micro-brittle wear generated in an ultra-low speed region, and thus remarkably improving the cutting lifespan of the cutting tool such as the drill or the ball end mill.
Public/Granted literature
- US20200238404A1 CUTTING TOOL HAVING PARTIALLY-REMOVED FILM FORMED THEREON Public/Granted day:2020-07-30
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