Invention Grant
- Patent Title: Grinding method
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Application No.: US17182833Application Date: 2021-02-23
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Publication No.: US11376707B2Publication Date: 2022-07-05
- Inventor: Yoshikazu Suzuki
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JPJP2020-045924 20200317
- Main IPC: B24B41/04
- IPC: B24B41/04 ; B24B1/00

Abstract:
A grinding method includes an oblique grinding step of rotating a grinding wheel about the central axis of a second shaft, tilting the second shaft to a first shaft of a rotatable chuck table such that the bottom of a first portion of the grinding wheel that is positioned above an outer circumferential portion of the chuck table is higher than the bottom of a second portion of the grinding wheel that is positioned above a central portion of the chuck table, and then moving the grinding wheel and the chuck table relatively closer to each other along a direction parallel to the first shaft, thereby forming a disk-shaped recess in the reverse side of the workpiece, and a tilt changing and grinding step of grinding the reverse side of the workpiece while gradually changing a tilt of the second shaft to orient parallel to the first shaft.
Public/Granted literature
- US20210291316A1 GRINDING METHOD Public/Granted day:2021-09-23
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