Invention Grant
- Patent Title: Components for a chemical mechanical polishing tool
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Application No.: US16596670Application Date: 2019-10-08
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Publication No.: US11376709B2Publication Date: 2022-07-05
- Inventor: Sreenidhi Attur
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Agent B. Todd Patterson
- Main IPC: B24B53/017
- IPC: B24B53/017 ; B24B57/02 ; B24B37/32 ; B24B37/34

Abstract:
A component in a CMP tool disclosed herein having a surface and a hydrophobic layer deposited on the surface. In one example, the component is a component for delivering a fluid in a CMP tool. The component for delivering a fluid in a CMP tool includes an elongated member having a first end and a second end, and an elongated upper surface extending between the two ends. A hydrophobic layer is deposited on the elongated upper surface. In another example, the component is a ring shaped body having an upper side and a lower side. A hydrophobic layer is deposited on the inner surfaces of both the upper and lower sides. In another example, the component is a disk shaped body having a top surface, bottom surface, and ledge defined by the top and bottom surfaces. A hydrophobic layer is deposited on the surfaces and the ledge.
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